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SmartNIC and IPU Hardware Portfolio

Product Overview

SmartNIC and IPU Hardware

In a world of reconfigurable computing, it is the software that defines the use case functionality. However, the wrong choice of hardware can severely downgrade the overall value and reliability of the solution.

Napatech SmartNICs and Infrastructure Processing Units (IPU) are designed to meet the standards of modern servers, with the rapidly changing world of data center and hyperscale deployments in mind.

Industry-Leading Reliability
When selecting a hardware solution, reliability is of the utmost importance. Software can be patched if faulty, but hardware needs a physical replacement, which is costly and complex.

For all Napatech designs, performance and reliability are unconditional tenets. With ~300,000 hours of mean time between failures (MTBF), Napatech hardware ensures uninterrupted, error-free operation for many years ahead – as validated by our long-term loyal customer base.

Superior Thermal Design
The power of SmartNIC and IPU technologies is only of value if it can be harnessed – and that requires cooling. An efficient cooling solution allows you to fit more compute power into your rack space, which translates into substantial TCO benefits. Napatech SmartNICs and IPUs are designed with active and passive cooling. The active solution provides 100% self-contained cooling with no requirements for a specific server airflow. This solution exhales most of the dissipated energy outside the server through front plate cutouts, which gives customers the freedom to choose server designs without worrying about cooling capacity.

To meet telco requirements, Napatech provides passively cooled solutions which are NEBS-compliant. A proprietary full body heatsink has been developed securing optimal cooling performance in the challenging NEBS applications for all critical components in the SmartNIC or IPU.

Hardware Resilience
Modern servers have quick-release PCI fastening mechanisms that allow for easy card replacement. Some of these designs, however, expose the card to vibration during transportation. Napatech SmartNICs and IPUs are designed specifically to ensure hardware resilience in this environment.

Standards of Excellence
Network appliances often require exceptions and compromises to fit a certain form factor or price point. In complex data center environments, it is therefore extremely beneficial if the hardware adheres to established industry standards, as this will make it easier for customers to integrate it in their solution. As a certified PCI-SIG member, Napatech has completed the meticulous compliance test, which demonstrates high standards of excellence.

Typical Applications
Napatech offers a range of software options for the SmartNIC and IPU hardware, addressing use cases within:

  • Cybersecurity
  • Network quality of experience assurance
  • Network & security forensics
  • Application performance management
  • Network test & measurement
  • Cyber defense
  • vSwitch acceleration
  • Virtual network monitoring
  • Storage offload
  • Network security offload

Solutions
Application and network performance monitoring
Subscriber monitoring
Capture to disk, replay from disk
Latency measurements
Cybersecurity threat detection
Network test and measurement
Cybersecurity threat prevention
5G User Plane Function (UPF) offlload
Full host CPU offload
OpenStack Infrastructure-as-a-Service (IaaS)
Bare metal cloud platform IaaS with tenant isolation

Platforms
Link-Capture™ Software
Link-Inline™ Software
Link-Virtualization™ Software
Link-Storage™ Software
Link-Security™ Software
Link-Programmable™
Smart Network Interface Cards (SmartNICs)
Infrastructure Processing Units (IPUs)

Services
Professional Services
Custom Development

 

SmartNIC and IPU Hardware
Active Cooling Models
Model

NT40A1x-SCC

 NT100A0x-SCC NT200A0x-SCC NT400D11-SCC NT400D1x-SCC
General Hardware Specifications SmartNIC SmartNIC SmartNIC SmartNIC SmartNIC
Height Half Full Full Full Full
Length Half Half Half Half Half
Width Single-Slot Single-Slot Single-Slot Single-Slot Single-Slot
FPGA technology XCKU11P [1]
XCKU15P [1]		 XCKU11P [1]
XCKU15P [1]
XCVU9P [1]		 XCVU5P [1]
XCVU7P [1]
XCVU9P [1]		  AGF014 AGF019 [1]
AGF022 [1]
AGF023 [1]
AGF027 [1]
– Embedded SoC         Quad-core Arm
Cortex-A53 [1]
– Crypto         AES and SM4 [1]
System on Chip (SoC)          
SDRAM FPGA DDR4
1×4 GB		 DDR4
2×4 GB [1]
2×8 GB [1]		 DDR4
3×4 GB [1]
3×8 GB [1]		 DDR4
3×4 GB		 DDR4 ECC
3×4 GB [1]
3×8 GB [1]
4×4 GB [1]
4×8 GB [1]
SDRAM SoC          
QSPI Flash memory 2×512 Mbit 2×512 Mbit 2×512 Mbit 2×1024 Mbit 2×1024 Mbit
M.2 NVMe x4 (2230/2242) expansion slot for SSD          
Host Interface PCIe3 x 8 PCIe3 x16 PCIe3 x16 PCIe4 x16 PCIe4 x16
Network Ports and Link Speeds          
Network ports 4×SFP+ 4×SFP28 2xQSFP28 2xQSFP28 2xQSFP28
1G [2] • • • [3] • [3] • [3]
10G [2] • • • [3] • [3] • [3]
25G [2]   • • [3] • [3] • [3]
40G [2]     • • •
50G [2]         • [4]
100G [2]         •
200G [2]         •
Management Port          
RJ45-F 1000BASE-T (on PCI bracket)       • •
Time Synchronization Ports [2]         •
Tyco Mini female for RJ45-F/ SMA-F adapter (on PCI bracket)          
Internal MCX-F for PPS and NT-TS   2 2   2 [1]
RJ45-F 1000BASE-T IEEE1588 PTP (on PCI bracket)   1 1 1 [1] 1 [1]
SMA-F for PPS & 10Mhz (on PCI bracket)   1 1 1 [1] 2 [1]
Time Synchronization Support          

Stratum 3E compliant TCXO

 •[1][6] •[6] •[6] •[6] •[6]
Synchronous Ethernet (SyncE) over RJ45 port [2]     •   •[1]
Synchronous Ethernet (SyncE) over network ports         •[1]
High-Speed Interconnect Port [2]          
Maximum bidirectional bandwidth 822 Gbps 900 Gbps 900 Gbps 900 Gbps 900 Gbps
Board Management          
MCTP over SMBus   • • • •
PLDM for Monitor and Control   • • • •
NCSI RBT       • •
FPGA temperature • • • • •
Pluggable module temperature • • • • •
Ambient temperature • • • • •
Power sensors • • • • •
Fan • • • • •
Power and Cooling          
Cooling solution Active Active Active Active Active
Max. power dissipation [5] 58 W 75 W 120 W 120 W 120 W
Airflow requirement None None None None None
General Hardware Properties          
Operating temperature 0°C to 45°C (32°F to 113°F)
Operating humidity  20% to 80%
MTBF (hours) 317,821 317,821 317,821 497,216 497,216
Weight 355 g 355 g 355 g 340 g TBD
Regulatory compliance (common) HERE PCI-SIG®, CE, CB, RoHS, REACH, cURus (UL), FCC, ICES, VCCI, RCM
Regulatory compliance (product specific) KCC[7] KCC KCC KCC[7] KCC[7]

[1] Mount option supported by HW
[2] Features depend on software support, please refer to product briefs for Link Software
[3] Breakout or QSFP28 to SFP28 adapter
[4] Breakout
[5] The power dissipation values indicate the capabilities of the hardware platform; the actual power consumption is dependent on the FPGA software payload. Refer to the Napatech product/feature data sheets for actual power consumption.
[6] Stratum 3E compliant TCXO option supported by HW
[7] Contact Napatech

SmartNIC and IPU Hardware
Passive Cooling Models
Model NT50B0x NT40A1x- NEBS NTA0x- NEBS NT200A0x-NEBS NT400D11-NEBS NT400D1x-PC N3070X F207xX F307xX
General Hardware Specifications SmartNIC SmartNIC SmartNIC SmartNIC SmartNIC SmartNIC SmartNIC IPU IPU
Height Half Full Full Full Full Full Full Full Full
Length Half Half Half Half Half Half 3/4 Half 3/4
Width Single-Slot Single-Slot Single-Slot Single-Slot Single-Slot Single-Slot Single-Slot Dual-Slot Dual-Slot
FPGA technology XCKU11P [1]
XCKU15P [1]		 XCKU11P [1]
XCKU15P [1]		 XCVU5P [1]
XCVU7P [1]
XCVU9P [1]		 XCVU5P [1]
XCVU7P [1]
XCVU9P [1]		 AGF014 AGF019 [1]
AGF022 [1]
AGF023 [1]
AGF027 [1]		 AGI022 [1]
AGI027 [1]
AGI041 [1]		 AGF022 [1]
AGF023 [1]
AGF027 [1]		 AGI022 [1]
AGI027 [1]
AGI041 [1]
– Embedded SoC           Quad-core Arm
Cortex-A53 [1]		 Quad-core Arm Cortex-A53 [1] Quad-core Arm Cortex-A53 [1] Quad-core Arm Cortex-A53 [1]
– Crypto           AES and SM4 [1] AES and SM4 [1] AES and SM4 [1] AES and SM4 [1]
System on Chip (SoC)               Intel®
Xeon®
D-1700 Series [1]
8 – 10 cores		 Intel®
Xeon®
D-99CMA3
32 cores
SDRAM FPGA DDR4
2×5 GB [1]
2×10 GB [1]		 DDR4
1×4 GB		 DDR4
2×4 GB [1]
2×8 GB [1]		 DDR4
3×4 GB [1]
3×8 GB [1]		 DDR4
3×4 GB [1]		 DDR4 ECC
3×4 GB [1]
3×8 GB [1]
4×4 GB [1]
4×8 GB [1]		 DDR4 ECC
4×4 GB [1]
 DDR4 ECC
4×4 GB [1]
3×4 + 1×8 GB [1]		 DDR4 ECC
4×4 GB [1]
SDRAM SoC               DDR4 ECC
2×8 GB [1]
3×8 GB [1]
3×16 GB [1]		 DDR5 ECC
2×12 GB
QSPI Flash memory 2×512 Mbit 2×512 Mbit 2×512 Mbit 2×512 Mbit 2×1024 Mbit 2×1024 Mbit 2×2048 Mbit 2×2048 Mbit 2×2048 Mbit
M.2 NVMe x4 (2230/2242)
expansion slot for SSD		               Up to 2 TB Up to 2 TB
Host Interface PCIe3 x16 PCIe3 x8 PCIe3 x16 PCIe3 x16 PCIe4 x16 PCIe4 x16 PCIe5 x16 PCIe4 x16 PCIe5 x16
Network Ports and Link Speeds                  
Network ports 2xSFP28 4×SFP+ 4×SFP28 2xQSFP28 2xQSFP56 2xQSFP56 2xQSFP-DD 2xQSFP56 2xQSFP-DD
1G [2] • • • • [3] • [3] • [3]   • [3]  
10G [2] • • • • [3] • [3] • [3] • [3] • [3] • [3]
25G [2] •   • • [3] • [3] • [3] • [3] • [3] • [3]
40G [2]       • • • • • •
50G [2]           • [4] • [4] • [4] • [4]
100G [2]       • • • • • •
200G [2]           • • • •
Management Port                  
RJ45-F 0BASE-T (on PCI bracket)               • •
Time Synchronization Ports [2]                  
Tyco Mini female for RJ45-F/ SMA-F
adapter (on PCI bracket)		                  
Internal MCX-F for PPS and NT-TS     2 2   2 [1]   2 [1]  
RJ45-F 0BASE-T IEEE1588 PTP
(on PCI bracket)		     1 1 1 [1] 1 [1]   1 [1]  
SMA-F for PPS & 10Mhz
(on PCI bracket)		 1 [1]   1 1 1 [1] 2 [1]   1 [1]  
Time Synchronization Support                  
Stratum 3 compliant TCXO •[1][6] •[1][6] •[6] •[6] •[6] •[6] •[6] •[6] •[6]
Synchronous Ethernet (SyncE)
over RJ45 port [2]		       • •[1] •[1]   •[1]  
Synchronous Ethernet (SyncE)
over network ports		         •[1] •[1]      
High-Speed Interconnect Port [2]                  
Maximum bidirectional bandwidth 900 Gbps 822 Gbps 900 Gbps 900 Gbps 900 Gbps 900 Gbps      
Board Management                  
MCTP over SMBus     • • • • • • •
PLDM for Monitor and Control     • • • • • • •
NCSI RBT         • • • • •
FPGA temperature • • • • • • • • •
Pluggable module temperature • • • • • • • • •
Ambient temperature • • • • • • • • •
Power sensors • • • • • • • • •
Power and Cooling                  
Cooling solution Passive Passive Passive Passive Passive Passive Passive Passive Passive
Max. power dissipation
supported by platform [5]		 55 W 5 W 75 W 120 W 120 W 120 W 150 W 250 W 375 W
Airflow requirement at
max power dissipation		 >= 3.5 m/s >= 2.5 m/s >= 2.5 m/s >= 2.5 m/s >= 3.5 m/s >= 3.5 m/s >= 4.0 m/s >= 2.5 m/s >= 4.0 m/s
General Hardware Properties                  
Operating temperature –5 °C to 55 °C (23 °F to 131 °F) -5 °C to 45 °C (23 °F to 113 °F)
Operating humidity 5% to 85%
MTBF (hours) 991,182 398,565 398,565 398,565 593,730 593,730 TBD 286,313 TBD
Weight 340 g 317 g 350 g 350 g 340 g 340 g TBD 682 g 953 g
Regulatory compliance
(common)		 PCI-SIG®, CE, CB, RoHS, REACH, cURus (UL), FCC, ICES, VCCI, RCM
Regulatory compliance
(product specific)		 NEBS, KCC[7] NEBS, KCC[7] NEBS, KCC[7] NEBS, KCC[7] NEBS, KCC[7] KCC[7] KCC KCC KCC

[1] Mount option supported by HW
[2] Features depend on software support, please refer to product briefs for Link Software
[3] Breakout or QSFP28 to SFP28 adapter
[4] Breakout
[5] The power dissipation values indicate the capabilities of the hardware platform; the actual power consumption is dependent on the FPGA software payload. Refer to the Napatech product/feature data sheets for actual power consumption.
[6] Stratum 3E compliant TCXO option supported by HW
[7] Contact Napatech

SmartNIC and IPU Hardware Portfolio